]> git.gir.st - hardpass.git/blame_incremental - kicad/hardpass-pcb/hardpass.pretty/Solderpads_OLED20Pin_.5mmPitch.kicad_mod
created footprint for sim slot
[hardpass.git] / kicad / hardpass-pcb / hardpass.pretty / Solderpads_OLED20Pin_.5mmPitch.kicad_mod
... / ...
CommitLineData
1(module Solderpads_OLED20Pin_.5mmPitch (layer F.Cu) (tedit 5728B90B)
2 (solder_mask_margin 0.1)
3 (attr smd)
4 (fp_text reference "OLED .5mm" (at 0 -7.8) (layer F.SilkS)
5 (effects (font (size 1.64 1.64) (thickness 0.05)))
6 )
7 (fp_text value VAL** (at 0 2.9) (layer F.SilkS)
8 (effects (font (size 1.64 1.64) (thickness 0.05)))
9 )
10 (pad 1 smd rect (at 4.7498 -2.4384 270) (size 7.5 0.254) (layers F.Cu F.Paste F.Mask)
11 (solder_mask_margin 0.2))
12 (pad 2 smd rect (at 4.2418 -2.4384 270) (size 7.5 0.254) (layers F.Cu F.Paste F.Mask)
13 (solder_mask_margin 0.2))
14 (pad 3 smd rect (at 3.7592 -2.4384 270) (size 7.5 0.254) (layers F.Cu F.Paste F.Mask)
15 (solder_mask_margin 0.2))
16 (pad 4 smd rect (at 3.2512 -2.4384 270) (size 7.5 0.254) (layers F.Cu F.Paste F.Mask)
17 (solder_mask_margin 0.2))
18 (pad 5 smd rect (at 2.7432 -2.4384 270) (size 7.5 0.254) (layers F.Cu F.Paste F.Mask)
19 (solder_mask_margin 0.2))
20 (pad 6 smd rect (at 2.2606 -2.4384 270) (size 7.5 0.254) (layers F.Cu F.Paste F.Mask)
21 (solder_mask_margin 0.2))
22 (pad 7 smd rect (at 1.7526 -2.4384 270) (size 7.5 0.254) (layers F.Cu F.Paste F.Mask)
23 (solder_mask_margin 0.2))
24 (pad 8 smd rect (at 1.2446 -2.4384 270) (size 7.5 0.254) (layers F.Cu F.Paste F.Mask)
25 (solder_mask_margin 0.2))
26 (pad 9 smd rect (at 0.762 -2.4384 270) (size 7.5 0.254) (layers F.Cu F.Paste F.Mask)
27 (solder_mask_margin 0.2))
28 (pad 10 smd rect (at 0.254 -2.4384 270) (size 7.5 0.254) (layers F.Cu F.Paste F.Mask)
29 (solder_mask_margin 0.2))
30 (pad 11 smd rect (at -0.254 -2.4384 270) (size 7.5 0.254) (layers F.Cu F.Paste F.Mask)
31 (solder_mask_margin 0.2))
32 (pad 12 smd rect (at -0.762 -2.4384 270) (size 7.5 0.254) (layers F.Cu F.Paste F.Mask)
33 (solder_mask_margin 0.2))
34 (pad 13 smd rect (at -1.2446 -2.4384 270) (size 7.5 0.254) (layers F.Cu F.Paste F.Mask)
35 (solder_mask_margin 0.2))
36 (pad 14 smd rect (at -1.7526 -2.4384 270) (size 7.5 0.254) (layers F.Cu F.Paste F.Mask)
37 (solder_mask_margin 0.2))
38 (pad 15 smd rect (at -2.2606 -2.4384 270) (size 7.5 0.254) (layers F.Cu F.Paste F.Mask)
39 (solder_mask_margin 0.2))
40 (pad 16 smd rect (at -2.7432 -2.4384 270) (size 7.5 0.254) (layers F.Cu F.Paste F.Mask)
41 (solder_mask_margin 0.2))
42 (pad 17 smd rect (at -3.2512 -2.4384 270) (size 7.5 0.254) (layers F.Cu F.Paste F.Mask)
43 (solder_mask_margin 0.2))
44 (pad 18 smd rect (at -3.7592 -2.4384 270) (size 7.5 0.254) (layers F.Cu F.Paste F.Mask)
45 (solder_mask_margin 0.2))
46 (pad 19 smd rect (at -4.2418 -2.4384 270) (size 7.5 0.254) (layers F.Cu F.Paste F.Mask)
47 (solder_mask_margin 0.2))
48 (pad 20 smd rect (at -4.7498 -2.4384 270) (size 7.5 0.254) (layers F.Cu F.Paste F.Mask)
49 (solder_mask_margin 0.2))
50)
Imprint / Impressum