(module UG-2864HSWEG01_0.96IN_WRAPAROUND (layer F.Cu) (tedit 0) (fp_text reference U1 (at -13.09 -15.69) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.065024)) (justify left bottom)) ) (fp_text value UG-2864HSWEG01 (at -13.09 9.1) (layer F.SilkS) (effects (font (size 0.77216 0.77216) (thickness 0.065024)) (justify left bottom)) ) (fp_line (start -13.353 -14.36) (end 13.35 -14.36) (layer F.SilkS) (width 0.127)) (fp_line (start 13.35 -14.36) (end 13.35 4.9) (layer F.SilkS) (width 0.127)) (fp_line (start 13.35 4.9) (end -13.35 4.9) (layer F.SilkS) (width 0.127)) (fp_line (start -13.35 4.9) (end -13.353 -14.36) (layer F.SilkS) (width 0.127)) (fp_line (start -10.872 -12.26) (end 10.872 -12.26) (layer Dwgs.User) (width 0.127)) (fp_line (start 10.872 -12.26) (end 10.872 -1.396) (layer Dwgs.User) (width 0.127)) (fp_line (start 10.872 -1.396) (end -10.872 -1.396) (layer Dwgs.User) (width 0.127)) (fp_line (start -10.872 -1.396) (end -10.872 -12.26) (layer Dwgs.User) (width 0.127)) (fp_text user 1 (at -9.95 -0.512 90) (layer Dwgs.User) (effects (font (size 0.77216 0.77216) (thickness 0.065024)) (justify left bottom)) ) (fp_text user 10 (at -3.65 -0.412 90) (layer Dwgs.User) (effects (font (size 0.77216 0.77216) (thickness 0.065024)) (justify left bottom)) ) (fp_text user 20 (at 3.3 -0.412 90) (layer Dwgs.User) (effects (font (size 0.77216 0.77216) (thickness 0.065024)) (justify left bottom)) ) (fp_text user 30 (at 10.45 -0.412 90) (layer Dwgs.User) (effects (font (size 0.77216 0.77216) (thickness 0.065024)) (justify left bottom)) ) (fp_text user "PCB EDGE (1.6mm)" (at -5.2 7) (layer Dwgs.User) (effects (font (size 0.77216 0.77216) (thickness 0.065024)) (justify left bottom)) ) (fp_line (start 13.35 7.5) (end -13.35 7.5) (layer Dwgs.User) (width 0.127)) (pad 1 smd rect (at -10.15 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 2 smd rect (at -9.45 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 3 smd rect (at -8.75 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 4 smd rect (at -8.05 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 5 smd rect (at -7.35 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 6 smd rect (at -6.65 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 7 smd rect (at -5.95 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 8 smd rect (at -5.25 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 9 smd rect (at -4.55 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 10 smd rect (at -3.85 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 11 smd rect (at -3.15 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 12 smd rect (at -2.45 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 13 smd rect (at -1.75 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 14 smd rect (at -1.05 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 15 smd rect (at -0.35 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 16 smd rect (at 0.35 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 17 smd rect (at 1.05 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 18 smd rect (at 1.75 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 19 smd rect (at 2.45 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 20 smd rect (at 3.15 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 21 smd rect (at 3.85 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 22 smd rect (at 4.55 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 23 smd rect (at 5.25 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 24 smd rect (at 5.95 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 25 smd rect (at 6.65 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 26 smd rect (at 7.35 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 27 smd rect (at 8.05 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 28 smd rect (at 8.75 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 29 smd rect (at 9.45 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad 30 smd rect (at 10.15 1.2 90) (size 2.2 0.35) (layers B.Cu B.Paste B.Mask)) (pad "" np_thru_hole circle (at -8 5.45) (size 0.4 0.4) (drill 0.4) (layers *.Cu)) (pad "" np_thru_hole circle (at 8 5.45) (size 0.4 0.4) (drill 0.4) (layers *.Cu)) )